- Code commande RS:
- 458-783
- Référence fabricant:
- AS1803
- Marque:
- Acc Silicones
29 pour livraison dès le lendemain (stock France)
145 Sous 2 jour(s) (stock Europe)
Ajouté
Prix pour la pièce
90,58 €
HT
108,70 €
TTC
Unité | Prix par unité |
1 + | 90,58 € |
- Code commande RS:
- 458-783
- Référence fabricant:
- AS1803
- Marque:
- Acc Silicones
Législation et Conformité
- Pays d'origine :
- GB
Détail produit
ACC Silicones Neutral Cure Thermally Conductive Adhesive
This thermally conductive adhesive sealant from Acc Silicones is a 1 part, non-corrosive RTV (room temperature vulcansing) silicone rubber, ideal for creating a secure bond with a range of applications. The AS1803 is perfect for the thermal coupling of electrical and electronic components, or between any surface where thermal conductivity or heat dissipation is vital due to the excellent thermal conductivity. This thermally conductive adhesive features a wide service temperature range, allowing it to be used with a range of materials. This sealant also features a rapid cure when in contact with atmospheric moisture, forming a tough weather and moisture resistant rubber. The AS1803 is part of a new family of products called acetone cure sealants that are solvent free.
Features and benefits
Wide operating range of -50°C to +220°C, making it ideal for use with a variety of applications
Excellent bond and adhesion strength, eliminating the need for welding techniques
Excellent thermal conductivity even at high temperatures
Strong cure process with weather and moisture resistant properties
1 part adhesive that is ready and easy to use
High thermal conductivity: 1.55 W/mK
Solvent free
Excellent bond and adhesion strength, eliminating the need for welding techniques
Excellent thermal conductivity even at high temperatures
Strong cure process with weather and moisture resistant properties
1 part adhesive that is ready and easy to use
High thermal conductivity: 1.55 W/mK
Solvent free
Application
Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as:
Heat sink bonding
Potting/encapsulating sensors
BGA die heat spreader interface
Chip scale packages
Power semiconductors
Heat sink bonding
Potting/encapsulating sensors
BGA die heat spreader interface
Chip scale packages
Power semiconductors
How to apply
Before applying, ensure surfaces are clean and free from grease, dust and contaminants. If supplied in cartridges, the AS1803 can be applied using either manual or pneumatic dispensers. It can also be applied from bulk containers using conventional drum dispensing equipment. For optimum bond strength, the thickness of the sealant joint should be between 1 and 2 mm and left untouched for at least 24 hours, but ideally longer if possible.
Can this thermal adhesive be removed?
Thermal adhesives such as grease and pastes can be removed if required using a combination of a thermal adhesive remover (or high concentrate rubbing alcohol) and a lint free micro fibre cloth. Please note special care must be taken when removing thermal compounds and protective clothing must be worn at all times.
What is the maximum operating temperature?
The maximum operating temperature of this thermally conductive sealant is +220°C.
Pâte au silicone - ACC
Caractéristiques techniques
Attribut | Valeur |
---|---|
Nom commercial | AS1803 |
Type d'adhésif | Adhésif en silicone |
Application | Régulation thermique |
Matériel Compatible | Métal, Plastique |
Type d'emballage | Cartouche |
Contenance | 310 ml |
Temps de durcissement | 8h |
Température maximum de fonctionnement | +220°C |
Température minimum de fonctionnement | -50°C |
Plage de température de fonctionnement | -50→ +220 °C. |
Composition chimique | Silicone |
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