Embase CI Hirose FX11, 80 pôles , 0.5 mm, 2 rangées enveloppe de protection

Prix dégressifs sur quantité

Sous-total (1 paquet de 5 unités)*

26,41 €

HT

31,69 €

TTC

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Temporairement en rupture de stock
  • Expédition à partir du 16 avril 2026
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Unité
Prix par unité
le paquet*
5 - 955,282 €26,41 €
100 - 3704,212 €21,06 €
375 - 14953,694 €18,47 €
1500 - 29953,066 €15,33 €
3000 +2,856 €14,28 €

*Prix donné à titre indicatif

Options de conditionnement :
Code commande RS:
700-8512
Référence fabricant:
FX11A-80P/8-SV(71)
Marque:
Hirose
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Marque

Hirose

Série

FX11

Type de produit

Embase CI

Pas

0.5mm

Nombre de contacts

80

Nombre de rangées

2

Enveloppé/Non-Enveloppé

enveloppe de protection

Système de connecteurs

Carte à carte

Placage du contact

Or

Matériau de contact

Alliage de cuivre

Pays d'origine :
ID

Hirose FX11 Series 0.5 mm High-Speed Board to Board Connectors with Ground Plate


FX11 series 0.5 mm high-speed board to board SMT header and receptacle connectors with a low profile design able to produce board to board mating heights of 2 mm, 2.5 mm and 3 mm. The 0.5mm pitch offers space saving on the PCB and makes these FX11 connectors Ideal for use in high density applications. These FX11 series board to board connectors feature SMT ground plates fixed to either side of the connectors for improved transmission characteristics. The signal and ground are arranged in a 10:1 ratio for ground stability and reduced noise. Metal fittings either end of the connector provide a robust retention to the PCB and protect against solder peeling and mechanical stress. These fittings also connect to the ground plates to provide a stronger ground. The contacts of these 0.5mm FX11 series high-speed board to board PCB connectors feature a long wiping distance for highly reliable electrical continuity. A solder gap in the board mounting portion of the contact helps to prevent solder wicking. These FX11 board to board connectors also feature PCB guide posts that provide extra stability on the PCB.

Features and Benefits


• High density design for PCB space saving

• Low profile design for board mating heights of 2 mm, 2.5 mm and 3 mm

• Ground plates for improved transmission efficiency

• 10 Signal: 1 Ground arrangement for noise reduction

• Metal fittings for robust connection to PCB and protection against solder peeling

• Highly reliable contacts with long wiping distance

• Solder gap on contacts to prevent solder wicking

• PCB guide posts for extra stability on PCB

Product Application Information


The low profile high density design of these 0.5mm FX11 series high-speed Board to Board connectors make them Ideal for use in miniature electronic equipment. Applications include notebook computers, PDAs and other portable devices

0.5mm Board to Board - Hirose FX11


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