Patin Bergquist x 0.005pouce 2.0W/m⋅K

The thermal gap pad is a highly efficient solution for thermal management in electronic assemblies. With superior thermal impedance and dielectric breakdown voltage, it ensures reliable performance in various applications. The fiberglass reinforcement enables it to withstand processing stresses while maintaining ease of handling during application.

Eliminates processing constraints typically associated with grease
Conforms to surface textures for an air-free interface between heat-generating components and heat sinks
Easy handling and installation prior to soldering and cleaning
Flame rating of V